| 1、SMT (Surface Mounting Technology) Workshop |
| Equipments:(12 lines) |
| FUJI lines |
| FL1 |
FGL-II+FCP4-3+FIP-II+REF |
FL2 |
FGL-II+FCP4-2+FIP-I+REF |
FL3 |
FGL-V+FCP4-3+FIP-II+REF |
| FL4 |
FGL-II+FCP4-3+FIP-I+REF |
FL5 |
FGL-V+FCP6+FIP-II+REF |
FL6 |
HDP-G1+FCP6+FIP-II+REF |
| MV lines |
| PL4 |
SPP-D+MV-2C+MPA-3+REF-N |
| MSH lines |
| PL1 |
SPP-G1+MSH2+MPA-G1+REF-A |
PL2 |
SPP-G1+MSH2+MPA-G1+REF-A |
PL3 |
SPP-G1+MSH2+MPA-G1+REF-A |
| Siemens line |
| SI1 |
DEK265+80S20+80F3+REF |
SI2 |
DEK288+80S20+80F3+REF |
| Equipment |
| L-I |
FGL-II+FCP4-2+FIP-1+REF |
L-II |
FGL-V+FCP43+FIP-II+REF |
L-III |
FGL-V+FCP4-3+FIP-II+REF |
| L-IV |
FGL-V+FCP6+FIP-II+REF |
L-V |
DEK-256+FCP6+FIP-II+REF |
L-VI |
DEK-256-FCP+FIP-II+REF |
|
|
| Capacity: |
| FUJI 2.3million chips/day; |
| MV 40ten thousand chips/day; |
| MSH 1.65million chip/day; |
| Siemens 55ten thousand chips/day; |
| 4.92million chips per day;monthly capacity 127.92million chips(26 day/month). |
|
| 2、AI (Auto-Insertion) Workshop |
| |
| Equipments: |
| J/W |
DYNAPERT |
4 pcs |
A/X |
PANASERT |
23 pcs |
| PANASERT |
7 pcs |
UNIVERSAL |
6 pcs |
| UNIVERSAL |
3 pcs |
DYNAPERT |
4 pcs |
| RD |
PANASERT |
23 pcs |
RD |
TDK |
1 pcs |
| Related machine: |
| ICT |
15 pcs |
PANASERT-W |
3 pcs |
| HI-1500 |
1 pcs |
EM5800L |
1 pcs |
| Sequencer |
UCSM-G |
2 pcs |
PROSERT |
1 pcs |
|
|
| Capacity:(Actual Capacity) |
| J/W: 4.88million chips/day; |
| A/X: 7.71million chips/day; |
| R/D: 3.17million chips/day; |
| capacity: 15.76million chips per day; |
| monthly capacity: 409.76million chip(26 days/month). |
|
| 3、C.O.B.(Chip on Board)Workshop |
 |
|
| 4、T.H. (Through-hole) Line: |
| Four TH Lines |
| TH Lines Capacity:40ten thousand chips/day |
|
| 5、Assembly Workshop (Finished-Products Assembly Line): |
|
| 6、PCBA Testing/ In-circuit Tester |
|
| 7、Functional Test |
|
| 8、Research and Development. |
|
| 9、Burn-in test |
|