1、SMT
(Surface Mounting Technology) Workshop
Equipments:(12
lines)
| FUJI
lines |
| FL1 |
FGL-II+FCP4-3+FIP-II+REF |
FL4 |
FGL-II+FCP4-3+FIP-I+REF |
| FL2 |
FGL-II+FCP4-2+FIP-I+REF |
FL5 |
FGL-V+FCP6+FIP-II+REF |
| FL3 |
FGL-V+FCP4-3+FIP-II+REF |
FL6 |
HDP-G1+FCP6+FIP-II+REF |
| MV
lines |
| PL4 |
SPP-D+MV-2C+MPA-3+REF-N |
|
|
| MSH
lines |
| PL1 |
SPP-G1+MSH2+MPA-G1+REF-A |
PL3 |
SPP-G1+MSH2+MPA-G1+REF-A |
| PL2 |
SPP-G1+MSH2+MPA-G1+REF-A |
|
|
| Siemens
line |
|
|
| SI1 |
DEK265+80S20+80F3+REF |
SI2 |
DEK288+80S20+80F3+REF |
Equipment
| L-I |
FGL-II+FCP4-2+FIP-1+REF |
L-II |
FGL-V+FCP43+FIP-II+REF |
| L-III |
FGL-V+FCP4-3+FIP-II+REF |
L-IV |
FGL-V+FCP6+FIP-II+REF |
| L-V |
DEK-256+FCP6+FIP-II+REF |
L-VI |
DEK-256-FCP+FIP-II+REF |
Capacity:
FUJI
2.3million chips/day；
MV 40ten thousand chips/day；
MSH 1.65million chip/day；
Siemens 55ten thousand chips/day；
4.92million chips per day;monthly capacity 127.92million chips(26
day/month).
2、AI
(Auto-Insertion)
Workshop
Equipments:
| J/W |
DYNAPERT |
4
pcs |
|
A/X |
PANASERT |
23pcs |
| PANASERT |
7
pcs |
UNIVERSAL |
6
pcs |
| UNIVERSAL |
3
pcs |
DYNAPERT |
4
pcs |
| RD |
PANASERT |
23pcs |
RD |
TDK |
1
pcs |
Related
machine:
| ICT |
15
pcs |
|
PANASERT-W |
3
pcs |
| HI-1500 |
1
pcs |
EM5800L |
1
pcs |
| Sequencer |
UCSM-G |
2
pcs |
PROSERT |
1
pcs |
Capacity:(Actual
Capacity)
J/W：4.88million chips/day;
A/X：7.71million chips/day;
R/D：3.17million chips/day;
capacity: 15.76million chips per day;
monthly
capacity: 409.76million chip(26 days/month).
3、C.O.B.（Chip
on Board）Workshop
4、T.H. (Through-hole)
Line:
Four TH Lines
TH
Lines Capacity:40ten thousand chips/day
5、Assembly Workshop (Finished-Products Assembly Line):
Four
Finished Products Assembly Lines
6、PCBA
Testing/ In-circuit Tester
 |
 |
| PCBA
Testing |
ICT |
7、Functional Test
8、Research and Development.
9、Burn-in test
|
